Long, Yangyang; Arndt, Matthias; Dencker, Folke; Wurz, Marc; Twiefel, Jens; Wallaschek, Jörg
(Rio de Janeiro : Elsevier, 2022)
Due to the complex mechanisms, the ultrasonic (US) wire bonding process is usually optimized in the way of varying the processing parameters including normal force, US power, and processing time. In this study, a new way ...